ETERNUS DX600 S6

The table below shows whether hot swap or hot expansion for components of the ETERNUS DX600 S6 is possible.

Table: Hot Swap and Hot Expansion Availability for Components (ETERNUS DX600 S6)

Component

Hot swap

Hot expansion

Remarks

Controller enclosure (CE)

Components can be individually replaced.

Controller module (CM)

¡ (*1)

System memory

¡ (*1)

¡ (*2)

BUD (*3)

¡ (*1)

Controller firmware

¡ (*1) (*4)

Host interface (FC-CA)

¡

¡

Host interface (10G iSCSI-CA)

¡

¡

Power supply unit for CE (CPSU)

¡

MP (*5)

×

NVMe SSD

¡

¡

Operation panel (PANEL)

¡

Battery Backup Unit (BBU)

¡

Battery Charger Unit (BCU)

¡

Battery Unit (BTU)

¡

Drive Adapter (DA)

¡

¡

Disk firmware

¡ (*4)

Drive enclosure (DE)

¡

¡

Replace the drive enclosure (DE) when the MP (*5) fails.

Power supply unit for DE (PSU)

¡

Disk (HDD)

¡

¡

NVMe SSD/SAS SSD

¡

¡

Operation panel (PANEL)

× (*6)

I/O module (IOM)

¡

Disk firmware

¡ (*4)

¡: Allowed / ×: Not allowed (cold swap is possible) / —: Not applicable

*1

All of the host interfaces on the CM that will have maintenance performed go offline. When a multipath configuration is used, switch to the host paths of the CM that will not have maintenance performed to continue operation.

*2

When hot expanded, each CM must be pulled out to expand. Therefore, all host interfaces on the CM to be expanded will temporarily go offline.

*3

Bootup and Utility Device.

*4

An I/O suspension may be required depending on the firmware changes.

*5

Mid Plane. This is a board that is located between the front and rear (controller (CM) or I/O module (IOM) side) of the ETERNUS DX.

*6

Operation can be continued during a failure. The status of the ETERNUS DX can be monitored via ETERNUS Web GUI or ETERNUS CLI.